ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,769, issued on Oct. 20, was assigned to Winbound Electronics Corp. (Taichung City, Taiwan). "Manufacturing method of semiconductor structur... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,770, issued on Oct. 20, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Manufacturing method of semiconductor structure"... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,771, issued on Oct. 20, was assigned to UTAC Headquarters Pte. Ltd. (Singapore). "Wafer adaptors, including systems and methods, for adapti... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,772, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Mitigation of first wafer effect" was invented by Yo... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,773, issued on Oct. 20, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method and substrate processing appa... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,774, issued on Oct. 20, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, inner tube and method of manufactu... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,775, issued on Oct. 20, was assigned to ACM RESEARCH (SHANGHAI) INC. (Shanghai). "Drying apparatus and method based on supercritical fluid"... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,776, issued on Oct. 20, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Drying system with integrated substrate alignment st... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,777, issued on Oct. 20, was assigned to Mitsubishi Electric Corp. (Tokyo). "Method for manufacturing semiconductor apparatus and semiconduc... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,778, issued on Oct. 20, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Substrate bonding apparatus and method of... Read More